Semiconductor module arrangement

United States of America Patent

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Apr 24, 2012
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Apr 24, 2008
app pub date
Oct 20, 2006
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Oct 20, 2006

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Abstract

A semiconductor arrangement has a silicon body with a first surface and a second surface and a thick metal layer arranged on at least one surface of the silicon body. The thickness of the thick metal-layer is at least 10 micrometers (μm).

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INFINEON TECHNOLOGIES AG	AM CAMPEON 1-12 NEUBIBERG 85579

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Bayerer, Reinhold	Warstein, DE	90	1313
Siepe, Dirk	Dortmund, DE	11	66

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Semiconductor module arrangement

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11551488

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PATENT NO	8164176
APP PUB NO	20080093729A1
SERIAL NO	11551488
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 24, 2012	US,8164176,B2 US8164176B2	GRANTED PATENT AS SECOND PUBLICATION
April 24, 2008	US,20080093729,A1 US20080093729A1	FIRST PUBLISHED PATENT APPLICATION

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11551488

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