Encapsulated metal resistor
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United States of America Patent
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Jul 26, 2011
Grant Date -
Apr 24, 2008
app pub date -
Oct 20, 2006
filing date -
Oct 20, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
The method provides a semiconductor structure and method for forming such a structure that provides for protection for resistive layers formed within the structure from contamination from adjacent layers. By encapsulating the resistive layer in a material that is resistant to the diffusion of contaminants it is possible to protect the resistive material during the processing required to manufacture the structure.
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