LIGHT EMITTING DIODE MODULE AND APPARATUS THEREOF
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United States of America Patent
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Issued Date -
May 1, 2008
app pub date -
Mar 27, 2007
filing date -
Oct 25, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A light emitting diode (LED) module employs a one-piece integrated column heat conductive electrode to carry at least one LED chip, so as to quickly remove the heat generated by the LED chip while emitting light. The LED module includes at least one LED chip, a column heat conductive electrode, an electrical insulating sleeve, and a center electrode. The first heat dissipation surface of the column heat conductive electrode has a screw thread that can be combined with a heat dissipation base having an internal thread. An LED apparatus combines a plurality of LED modules and the heat dissipation base, and uses a metal heat dissipation layer on the heat dissipation base to quickly remove the heat generated by the LED chip while emitting light.
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