SINGLE-LAYER POLISHING PAD
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United States of America Patent
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app pub date -
Dec 26, 2007
filing date -
May 5, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.
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