Heat transfer unit extrusion process
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United States of America Patent
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N/A
Issued Date -
May 8, 2008
app pub date -
Nov 3, 2006
filing date -
Nov 3, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An extrusion process for forming heat transfer units or portions thereof for use in a cooling system for cooling heat generating components in an electronic system. Several embodiments of the present invention are presented. In one embodiment, a material is extruded through a die and a housing is formed that can be used as the housing or a portion thereof, for the heat transfer unit.
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