Heat Pipe Multilayer Capillary Wick Support Structure
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United States of America Patent
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Issued Date -
May 8, 2008
app pub date -
Nov 3, 2006
filing date -
Nov 3, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat pipe multilayer capillary wick support structure includes a hollow pipe body, a first capillary wick and a second capillary wick in the pipe body, and an auxiliary transmission structure attached between the first and second capillary wicks; wherein the auxiliary transmission structure is composed of a plurality of running plates extended axially along the pipe body and separated parallelly with each other, and a plurality of connecting ribs connected between the running plates for forming a plurality of slender steam passages on the auxiliary transmission structure, so as to constitute a heat pipe multilayer capillary wick support structure to fit bend pipes and increase the capillary force.
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