Tie Layer and Method for Forming Thermoplastics
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United States of America Patent
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N/A
Issued Date -
May 8, 2008
app pub date -
Jan 13, 2006
filing date -
Jan 14, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A tie layer for bonding a ceramic or metallic coating to a thermoplastic substrate is described. The tie layer comprises from 2 to 70% ceramic and/or metallic filler particles in a thermoplastic matrix. The thermoplastic matrix is compatible with the thermoplastic substrate. Further, a method of bonding a ceramic or metallic coating to a thermoplastic substrate is disclosed. The method involves applying the tie layer to the substrate, and bonding the ceramic or metallic coating to the tie layer using a coating process that consolidates the substrate, the tie layer and the coating. The tie layer and process are useful in coating implantable prosthetic bones, or coating industrial items used in automotive, aeronautical or medical industries.
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