Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
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United States of America Patent
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Aug 24, 2010
Grant Date -
May 8, 2008
app pub date -
Dec 31, 2007
filing date -
Jun 19, 2001
priority date (Note) -
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Abstract
Systems, methods and mediums are provided for dynamic adjustment of sampling plans in connection with a wafer (or other device) to be measured. The invention adjusts the frequency and/or spatial resolution of measurements on an as-needed basis when one or more events occur that are likely to indicate an internal or external change affecting the manufacturing process or results. The dynamic metrology plan adjusts the spatial resolution of sampling within-wafer by adding, subtracting or replacing candidate points from the sampling plan, in response to certain events which suggest that additional or different measurements of the wafer may be desirable. Further, the invention may be used in connection with adjusting the frequency of wafer-to-wafer measurements.
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