HERMETIC SEALING OF MICRO DEVICES
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United States of America Patent
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Issued Date -
May 15, 2008
app pub date -
Nov 10, 2006
filing date -
Nov 10, 2006
priority date (Note) -
Abandoned
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Abstract
A method for packaging a micro device includes encapsulating a micro device in a chamber on a substrate, wherein the chamber is defined by spacer walls and an encapsulation cover, removing a portion of the encapsulation cover and portions of the spacer walls to expose a surfaces of the spacer walls, and forming a layer of a sealing material on the exposed surfaces of the spacer walls to hermetically seal the micro device in the chamber.
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