Method And Apparatus For Localized Bonding
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United States of America Patent
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Issued Date -
May 15, 2008
app pub date -
Nov 14, 2006
filing date -
Nov 14, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
One or more cavities are formed in the bonding surfaces of one, all, or some of the elements to be bonded. These cavities serve as receptacles for the bonding material and are where the bonds are localized. The cavities are of sufficient size and shape so that their volume is greater than the volume of bonding material forming the bond. This ensures that when the elements are brought into contact with one another to mate, the bonding material, which can flow prior to solidifying into a bond, will flow into the cavities and will not impede the separation of the parts. This allows the parts to be mated with nominally zero separation. Once solidified, the bonding material forms a localized bond inside each cavity. Different cavity shapes, such as, rectangular, circular, or any other shape that can be injected or filled with adhesive material may be used.
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