Flux for Lead-Free Solder and Solder Paste
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United States of America Patent
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Issued Date -
May 22, 2008
app pub date -
Dec 27, 2005
filing date -
Dec 28, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A flux for a lead-free solder that is able to reduce 'void(s) appear within solder joint', 'void(s) appear within solder joint', and 'solder-balling' without impairing general solderabilities. The flux for a lead-free solder comprising 6-55 wt % of a polyvalent alcohol ester of a resin acid (a1) as a base resin (A). Further, a solder paste comprising the said flux for a lead-free solder and a lead-free solder powder provides a very small number of void(s) or a very small amount thereof.
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