METHOD AND COMPOSITION FOR DIRECT METALLIZATION OF NON-CONDUCTIVE SUBSTRATES
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United States of America Patent
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Issued Date -
May 22, 2008
app pub date -
Feb 8, 2007
filing date -
Feb 8, 2006
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Abandoned
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Abstract
The present invention relates to a method for the metallization of an electrically non-conductive substrate using a thiosulfate conductor which employs a thiosulfate-containing conductor solution further comprising an alkali metal ion selected from the group consisting of lithium, potassium, rubidium, caesium, and combinations thereof.
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