System and method for solder bump plating
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United States of America Patent
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Issued Date -
May 22, 2008
app pub date -
Nov 21, 2006
filing date -
Nov 21, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a system single-metal plating, a system for binary-metal plating, and a system for solder-bump plating. The solder-bump plating system comprises a single-metal plating system for plating a preconditioned substrate to form a single-metal plated substrate; and a binary-metal plating system for plating the single-metal plated substrate. In a preferred implementation, the solder-bump plating system of the present invention is configured to single-metal plate a preconditioned substrate using a first plating solution to provide a single-plated substrate; to single-metal plate the single-plated substrate using a second plating solution to provide a double-plated substrate; and to binary-metal plate the double-plated substrate using a third plating solution to provide a solder-bump plated substrate. A novel apparatus for use in plating a substrate comprises an electrically conductive holder comprising a handle portion having at least one electrical contact and a holder portion having at least one flexible electrical contact.
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