PACKAGING MICRO DEVICES
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United States of America Patent
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Issued Date -
May 22, 2008
app pub date -
Nov 21, 2006
filing date -
Nov 21, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for applying anti-stiction material to a micro device includes encapsulating a micro device in a chamber, vaporizing anti-stiction material in a container to form vaporized anti-stiction material, transferring the vaporized anti-stiction material from the container to the chamber, and depositing the vaporized anti-stiction material on a surface of the micro device.
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