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Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
May 22, 2008
app pub date -
Sep 23, 2005
filing date -
Nov 29, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention relates to a substrate with a metallic carrier layer, at least one insulating layer which is provided on a surface side of the carrier layer and which is produced with the aid of a polymer material or polymer component, in addition to metallization which is provided on a partial area of the insulating layer and electrically separated from the carrier layer by means thereof. The insulating layer contains at least one other component which, as a distance-maintaining component, defines the thickness of the insulating layer and is made of a dimensionally stable inorganic material.
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