Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart
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United States of America Patent
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Dec 14, 2010
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N/A
app pub date -
Nov 20, 2006
filing date -
Nov 6, 2006
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Abstract
A semiconductor device exhibits a first metal layer, made of a first metal, with at least one contiguous subsection. At least one second metal layer, made of a second metal, is placed on the contiguous subsection of the first metal layer. The second metal is harder than the first metal. The second metal layer is structured to form at least two layer regions, which are disposed on the contiguous subsection of the first metal layer. The second metal exhibits a boron-containing or phosphorus-containing metal or a boron-containing or phosphorus-containing metal alloy.
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