Buffer Layer for Strings
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United States of America Patent
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Issued Date -
May 29, 2008
app pub date -
Nov 15, 2007
filing date -
Nov 16, 2006
priority date (Note) -
Abandoned
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Abstract
A thin buffer layer is used to coat on the multi-filament wrapped string to fill the gaps. The polymers of the buffer-layer coating have a high melt-flow (low viscosity) during coating process to fill all the gaps between the filaments, and the filaments are fixed by the coatings onto base core materials.
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