POLISHING COMPOSITION AND POLISHING METHOD
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United States of America Patent
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Issued Date -
May 29, 2008
app pub date -
Nov 20, 2007
filing date -
Nov 24, 2006
priority date (Note) -
Abandoned
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Abstract
To provide a polishing composition which is capable of selectively polishing a silicon oxide film against a polysilicon film, and a polishing method employing such a polishing composition. The polishing composition of the present invention comprises abrasive grains selected from silica and ceria; an alkali selected from ammonia, an ammonium salt, an alkali metal salt and an alkali metal hydroxide; and an organic modified silicone oil selected from a polyoxyethylene-modified silicone oil, a poly(oxyethyleneoxypropylene)-modified silicone oil, an epoxy/polyether-modified silicone oil and an amino/polyether-modified silicone oil.
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