Post passivation interconnection process and structures
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United States of America Patent
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Sep 13, 2011
Grant Date -
Jun 5, 2008
app pub date -
Jan 16, 2008
filing date -
Sep 9, 2004
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Abstract
A system and method for forming post passivation metal structures is described. Metal interconnections and high quality electrical components, such as inductors, transformers, capacitors, or resistors are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.
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