COMPOSITE STRUCTURE WITH ORGANOPHOSPHONATE ADHERENT LAYER AND METHOD OF PREPARING
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United States of America Patent
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Issued Date -
Jun 5, 2008
app pub date -
Sep 26, 2007
filing date -
Sep 28, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides an article comprising: a substrate having a surface and comprising electrodeposited copper foil or copper alloy foil; an adherent layer serving to promote adhesion, comprising at least one organophosphonate or salt thereof covalently bound to the surface; and a functional layer, comprising at least one polymer bound to the adherent layer. The present invention further provides devices comprising a heat source or electronic component and the article described above, wherein the heat source is in thermal contact with the substrate and the electronic component is in electrical contact with the substrate. Also provided is a method of producing the above-described article.
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