Structure and method of making interconnect element having metal traces embedded in surface of dielectric
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United States of America Patent
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app pub date -
May 23, 2007
filing date -
Jan 24, 2006
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Abandoned
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Abstract
An interconnect element is provided which includes a dielectric element having a major surface. Metal interconnect patterns are embedded in recesses which extend inwardly from the major surface, the outer surfaces of the interconnect patterns being substantially co-planar with the major surface and extending in one or more directions of the major surface. A projecting conductive film extends over the major surface in at least one direction parallel to a plane defined by the major surface such that it contacts the dielectric element along at least a portion of the major surface and conductively contacts an outer surface of at least one of the metal interconnect patterns.
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