Method for Depositing Palladium Layers and Palladium Bath Therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 12, 2008
app pub date -
Jan 11, 2006
filing date -
Jan 12, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Copper conductor tracks of circuit boards require a coating which has good corrosion resistance and is suitable for multiple solderability and bondability to enable them to be provided with electronic components. These properties are fulfilled by a layer system which has an intermediate layer of autocatalytically deposited nickel on which a palladium layer has been deposited by charge exchange. To ensure reliable adhesive strength, low porosity and a good homogeneity, the bath for deposition of the palladium layer contains a copper compound. To passivate the palladium layer, the layer system can be provided with a final layer of gold deposited by charge exchange and/or autocatalytically.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully