Method and apparatus for drying substrates using a surface tensions reducing gas
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United States of America Patent
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N/A
Issued Date -
Jun 26, 2008
app pub date -
Dec 20, 2006
filing date -
Dec 20, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for processing a substrate using a proximity head is disclosed. The method is initiated by, providing a head with a head surface positioned proximate to a surface of the substrate. The head has a width and a length, and the head has a plurality of ports that are configured in rows along the length of the head. The plurality of rows can extend over a width of the head, and there is a first group of ports configured to dispense a first fluid. The first fluid is dispensed to the surface of the substrate forming a meniscus between the surface of the substrate and the surface of the head. The method also includes delivering gaseous carbon dioxide from a second group of ports of the head to an interface between the meniscus and the substrate. The carbon dioxide assists in promoting a reduced surface tension on the meniscus relative to surface of the substrate.
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