COEFFICIENT OF THERMAL EXPANSION ADAPTOR

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United States of America Patent

APP PUB NO 20080160274A1
SERIAL NO

11618885

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In designing a precision monolithic structure having all discrete components with different Coefficient of Thermal Expansion (CTE) permanently bonded together, to avoid internal stress caused by changing of temperature: The Coefficient of Thermal Expansion (CTE) Adaptor must be bonded between two components having different Coefficient of Thermal Expansion (CTE); the Bonding Interfaces must be parallel; the Coefficient of Thermal Expansion (CTE) Adaptor is made of material having varied CTE, the variation must be gradual and in only one direction, which is perpendicular to the said Bonding Interfaces; at each Bonding Interface, the CTE of the CTE Adaptor must match the CTE of bonding component in certain degree.

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Patent Owner(s)

Patent OwnerAddress
DANG CHI HUNGNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dang, Chi Hung Tucson, AZ 8 232

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