METHODS AND SYSTEMS FOR WAFER LEVEL PACKAGING OF MEMS STRUCTURES
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United States of America Patent
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Issued Date -
Jul 10, 2008
app pub date -
Jan 4, 2008
filing date -
Jan 5, 2007
priority date (Note) -
Abandoned
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Abstract
A method of forming a package for a MEMS structure coupled to a substrate includes depositing an encapsulant material on the substrate and patterning the encapsulant material to form a plurality of encapsulated structures. The method also includes depositing a first capping layer on the substrate and forming one or more release hole patterns in the first capping layer. The method further includes removing the encapsulant material and depositing a second capping layer.
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