CATALYTIC SURFACE ACTIVATION METHOD FOR ELECTROLESS DEPOSITION

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United States of America Patent

APP PUB NO 20080166500A1
SERIAL NO

11767178

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a catalytic surface activation method for electroless deposition comprising a metallic aerosol nanoparticle generation step of generating metallic aerosol nanoparticles, which act as plating initiation catalyst; a metallic aerosol nanoparticle fixation step of fixing the resultant metallic aerosol nanoparticles on a plating surface; and an electroless deposition step of impregnating the material to be plated in an electroless deposition solution to form a plating layer on the plating surface on which the metallic aerosol nanoparticles have been fixed. The catalytic surface activation method for electroless deposition of the present invention is applicable to large-scale plating with simple process and superior applicability, improves the plating characteristics with little impurity generation, requires no post-treatment process for removing impurities and is environment-friendly with no wastewater generation by directly fixing metallic aerosol nanoparticles on the material to be plated.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRY-ACADEMIC COOPERATION FOUNDATION YONSEI UNIVERSITY50 YONSEI-RO SEODAEMUN-GU SEOUL 03722

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BYEON, Jeong-Hoon Chungcheongnam-do, KR 6 5
HWANG, Jung-Ho Seoul, KR 21 125
PARK, Jae-Hong Seoul, KR 129 1299
YOON, Ki-Young Seoul, KR 6 5

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