COPPER WELDING SOLID WIRE WITH GOOD ARC STABILITY
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United States of America Patent
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Issued Date -
Nov 30, 2006
app pub date -
Mar 23, 2006
filing date -
May 25, 2005
priority date (Note) -
Abandoned
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Abstract
Disclosed is a copper plating solid wire for MAG welding with excellent arc stability during welding, in which the solid wire for MAG welding is manufactured by high-speed copper plating by being immersed in a copper plating solution to make a plating layer of 0.2-1.0 μm in thickness, and the plating layer comprises 100-1000 ppm of Fe, an alkali metal (Na), and alkaline earth metals (Mg, Ca) in total wherein the content of the alkali metal (Na) and the alkaline earth metals (Mg, Ca) ranges from 10 ppm to 500 ppm. According to the present invention, the copper plating solid wire for MAG welding with excellent feedability and arc stability during welding can be obtained despite the high-speed plating process.
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