Structure and method of making interconnect element having metal traces embedded in surface of dielectric
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United States of America Patent
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app pub date -
Aug 29, 2007
filing date -
Oct 6, 2004
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Abandoned
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Abstract
A multilayer interconnect element is provided which includes at least one dielectric element in which metal interconnect patterns are exposed at an outer surface thereof, the metal interconnect patterns having outer surfaces which are co-planar with an exposed outer surface of the dielectric element. In addition, multilayer interconnect elements are provided in which second interconnect elements which do not have co-planar interconnect patterns are integrated therewith as intermediate elements, and the resulting multilayer interconnect element has co-planar interconnect patterns.
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