THERMAL SIGNATURE TARGET FORM
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United States of America Patent
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N/A
Issued Date -
Jul 17, 2008
app pub date -
Nov 5, 2007
filing date -
Jan 17, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A three-dimensional molded thermal signature target form comprising a conductive polymer material suitable for conducting infrared radiation such that a thermal signature is created and viewable by any number of suitable IR imaging or viewing systems. The thermal signature target form includes embedded busbars attached to a power source. The thermal signature target form can provide a realistic, inexpensive and safe live-fire target for training in thermal image recognition and shooting.
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