Importance

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Abstract

The present invention related to a semiconductor wafer cleaning system comprising a preliminary cleaning station for removing particles on a wafer in advance by spraying deionized water thereon; a first cleaning station for cleaning remaining particles firstly by rotating frictionally a pair of brushes disposed to be contacted with a front surface and a back surface of the wafer and by spraying chemicals thereon through a chemical sprayer being provided independently; a first rinsing station for rinsing by spraying a cleaning liquid onto the firstly cleaned wafer at the first cleaning station; a second cleaning station for cleaning particles secondly remained on the front surface and the back surface of the wafer by spraying the chemicals onto the firstly rinsed cleaned wafer at the first rinsing station through a chemical sprayer being provided independently using the same structure and manner as those of the first cleaning station; a second rinsing station for rinsing by spraying the cleaning liquid onto the secondly cleaned wafer at the second cleaning station; and a dry station for drying the remained cleaning liquid using centrifugal force generated by rotating the rinsed wafer at the second rinsing station at a high speed. According to the present invention, a waiting time of entry into each cleaning station is minimized by processing a cleaning operation and a rinsing operation of a surface-polished wafer in a cleaning station and a rinsing station which are provided separately and independently thereby improves wafer productivity significantly by solving a delayed phenomenon in a whole process of wafer manufacturing.

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First Claim