Injection molding apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7670134
APP PUB NO 20080175946A1
SERIAL NO

11874302

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An injection molding apparatus capable of minimizing cracks at the corners of a mold is provided. The injection molding apparatus includes first and second molds that mate with each other to define a molding cavity, a stationary member that supports the first mold, a movable member that supports the second mold and moves backwards and forwards together with the second mold, and a plurality of pressing members installed around the first mold so as to press a periphery of the first mold toward the molding cavity by a pressing force of the movable member when the first mold is mated with the second mold.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hwang, Han Sub Suwon-si, KR 3 7
Lee, Jong Won Seoul, KR 174 1346
Lee, Sang Hun Seoul, KR 202 1068
Min, Sung Ki Suwon-si, KR 7 32

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