ELECTRONIC PACKAGE STRUCTURE
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Oct 31, 2007
filing date -
Jan 31, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electronic package structure including a first carrier, at least one first electronic element, at least one second electronic element, and an encapsulant is provided. The first carrier has a first carrying surface and a second carrying surface opposite to the first carrying surface. The first electronic element is disposed on the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The encapsulant at least covers the first electronic element, the second electronic element, and a part of the first carrier. The space utilization rate of the first carrier of the electronic package structure is higher.
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