ELECTRONIC PACKAGE STRUCTURE
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United States of America Patent
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-
N/A
Issued Date -
Jul 31, 2008
app pub date -
Mar 12, 2007
filing date -
Jan 31, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An electronic package structure including a first carrier, at least one first electronic element, and a second electronic element is provided. The first carrier has a first carrying surface and a second carrying surface opposite to each other. The first electronic element is disposed above the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The volume of the second electronic element is larger than that of the first electronic element.
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