Compositions for electronic circuitry applications and methods relating thereto
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United States of America Patent
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Issued Date -
Aug 7, 2008
app pub date -
Nov 19, 2007
filing date -
Nov 17, 2006
priority date (Note) -
Abandoned
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Abstract
Compositions useful in circuitry substrates are described which have a polyimide component, and a sterically hindered hydrophobic epoxy component. Generally, a flowable precursor is applied and then cured to a wholly or partially solidified mass. The invention is also directed to methods of forming a passive electrical component upon or into a circuit board.
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