US Patent Application No: 2008/0185,708

Number of patents in Portfolio can not be more than 2000

Stackable semiconductor package having metal pin within through hole of package

ALSO PUBLISHED AS: 7656031
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Abstract

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The present invention provides a stackable semiconductor having an interconnect board for providing electrical interconnections, the package includes a plurality of solders disposing onto the interconnect board; and a conducting metal pin passing through each solder and the interconnect board, the metal pins having at least one end disposes on the semiconductor package, wherein when a plurality of the stackable semiconductor packages are stacked together, the exposed end of the corresponding conducting pins are bonded together. A method of manufacturing the same is also provided.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
BRIDGE SEMICONDUCTOR CORPORATIONTAIPEI126

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Cheng-Chung Hsinchu, TW 60 156
Hock, Tan Chin Singapore, SG 1 6
Lin, Charles WC 34 Pinewood Grove, Singapore 738290, SG 94 200
Wang, Chia-Chung Hsinchu, TW 146 301

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
RENESAS ELECTRONICS CORPORATION (3)
8,159,058 Semiconductor device having wiring substrate stacked on another wiring substrate 2 2008
8,698,299 Semiconductor device with wiring substrate including lower conductive pads and testing conductive pads 0 2012
8,766,425 Semiconductor device 0 2013
 
QUALCOMM INCORPORATED (2)
8,742,603 Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC) 0 2010
8,461,676 Soldering relief method and semiconductor device employing same 0 2011
 
STATS CHIPPAC LTD. (1)
7,888,184 Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof 2 2009

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