Method of Manufacture of Electronic or Functional Devices
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United States of America Patent
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N/A
Issued Date -
Aug 14, 2008
app pub date -
Jun 29, 2005
filing date -
Jun 29, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Plastic or other electronic devices are formed on a flexible substrate using inkjet printing techniques. To avoid registration difficulties arising from distortion of the substrate, deposition is conducted on a rigid substrate to which a release layer is applied. After application of a type layer which serves as the permanent, flexible substrate, the structure is released from the temporary rigid substrate.
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