Importance

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Abstract

The invention relates to a multi-layered printed circuit board (1) comprising conductive test surfaces (7) on at least one inner layer (2) for determining a possible misalignment of an inner layer or an inner layer structuring, the conductive test surfaces consisting of ring structures (7.i) which are arranged in a row and define inner non-conductive different-sized surfaces (8.i). The inventive printed circuit board also comprises metallised boreholes (5) in the region of the test surfaces. If there is no misalignment or only negligible misalignment, said boreholes (5) are located in the region of the inner, non-conductive surfaces (8.i). However, in the event of non-negligible misalignment, at least one borehole (5) is located in the region of one of the conductive ring structures (7.i) and thus comprises a conductive connection to the ring structure (7.i). The test surface ring structures (7.i) are divided into segments (a, b, c, d) in the peripheral direction, said segments (a, b, c, d) being separated from each other in the peripheral direction by non-conductive separating regions (9).

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First Claim