Trimming Of Embedded Passive Components Using Pulsed Heating
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United States of America Patent
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Issued Date -
Aug 14, 2008
app pub date -
May 6, 2005
filing date -
May 6, 2004
priority date (Note) -
Abandoned
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Abstract
There is described a printed circuit board with a thermally trimmable component embedded therein. A layer of refractory insulating material is provided to provide mechanical support and chemical passivation for the thermally trimmable component. The component is trimmed by applying a sequence of heat pulses the a heating element, which could be the component itself or a separate element. A cavity may be burned in the substrate to provide thermal isolation for the thermally trimmable component.
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