Use Of Heat-Activated Adhesive For Manufacture And A Device So Manufactured
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United States of America Patent
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Issued Date -
Aug 14, 2008
app pub date -
Jun 22, 2006
filing date -
Jul 8, 2005
priority date (Note) -
Abandoned
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Abstract
The invention is based on use of a heat-activated adhesive for manufacturing of intelligent devices comprising printed conductive electronics on a flexible substrate, where the adhesive is an anisotropic electrically conductive adhesive and is applied to the substrate as a thin film which can be used for electrical connections and for providing mechanical stability to the printed conductive electronics.
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