ARCHITECTURE FOR FACE-TO-FACE BONDING BETWEEN SUBSTRATE AND MULTIPLE DAUGHTER CHIPS
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United States of America Patent
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app pub date -
Apr 14, 2008
filing date -
Sep 29, 2004
priority date (Note) -
Abandoned
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Abstract
An integrated circuit system includes a first integrated circuit die and a family of second integrated circuit dice. The first integrated circuit die have input/output circuits disposed thereon and further have a first array of face-to-face bonding structures disposed on a first face thereof. Each member of the family of second integrated circuit dice have logical function circuits disposed thereon and further have a second array of face-to-face bonding structures disposed on a first face thereof. The second array of face-to-face bonding structures of each member of the family mates with a different portion of the first array of face-to-face bonding structures.
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