AMORPHOUS CARBON METAL-TO-METAL ANTIFUSE WITH ADHESION PROMOTING LAYERS
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United States of America Patent
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app pub date -
Apr 15, 2008
filing date -
Dec 27, 2002
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Abandoned
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Abstract
A metal-to-metal antifuse having a lower metal electrode, a lower thin adhesion promoting layer disposed over the lower metal electrode, an amorphous carbon antifuse material layer disposed over the thin adhesion promoting layer, an upper thin adhesion promoting layer disposed over said antifuse material layer, and an upper metal electrode. The thin adhesion promoting layers are about 2 angstroms to 20 angstroms in thickness, and are from a material selected from the group comprising Si.sub.xC.sub.y and Si.sub.xN.sub.y. The ratio of x to y in Si.sub.xC.sub.y is in a range of about 1.+-.0.4, and the ratio of x to y in Si.sub.xN.sub.y is in a range of about 0.75.+-.0.225.
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