CATALYTIC TREATMENT METHOD, ELECTROLESS PLATING METHOD, AND METHOD FOR FORMING CIRCUIT USING ELECTROLESS PLATING
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United States of America Patent
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app pub date -
Mar 31, 2008
filing date -
Oct 4, 2005
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Abstract
A catalyst layer which enables an electroless plating method to be carried out can be formed by an inexpensive and simple process without using palladium. There are provided a tin treatment step of bringing a substrate into contact with a tin compound aqueous solution containing a tin compound; after the tin treatment step, a copper treatment step of bringing a substrate 1 into contact with a copper compound aqueous solution containing a copper compound; after the copper treatment step, a diluted sulfuric acid treatment step of bringing the substrate 1 into contact with diluted sulfuric acid; after the diluted sulfuric acid treatment step, a plating treatment step of bringing the substrate 1 into contact with a plating solution to form a copper plating film 2; and after the plating treatment step, a heat treatment step of heating the substrate 1 in an atmosphere substantially containing no oxygen and hydrogen.
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