Aqueous Epoxy Resin Systems

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United States of America Patent

APP PUB NO 20080200599A1
SERIAL NO

11665304

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An aqueous epoxy resin system ABC comprising an aqueously dispersed epoxy resin A having, on the average, at least one epoxy group per molecule, a water-soluble or water-dispersible curing agent B which comprises the reaction product of an amine B1 having at least one primary and at least one secondary amino group, and an adduct B2 of a polyalkylene ether polyol B21 and an opexide component B22, and aminoplast compound C having a mass fraction of at least 0.1% of sulphonate or sulphonic acid groups, a coating composition ABCD for thick layer applications comprising the aqueous epoxy resin system ABC and at least one particulate filler D selected from the group consisting of talc, mica, quartz, titanium dioxide, aluminium dioxide, calcium carbonate, and dolomite, and a process for coating mineral or concrete based substrates or floors with such coating compositions.

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Patent Owner(s)

Patent OwnerAddress
CYTEC SURFACE SPECIALTIES AUSTRIA GMBH8402 WERNDORF

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gerlitz, Martin Graz, AT 13 118
Gobb, Manfred Lieboch, AT 1 4
Gollner, Andreas Graz, AT 27 105
Grasboeck, Rosemaria Graz, AU 3 15
Lunzer, Florian Barcelona, ES 21 40
Wonner, Johann Rodgau, DE 12 85

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