Stacked Package and Method of Fabricating the Same
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United States of America Patent
Stats
-
N/A
Issued Date -
Aug 28, 2008
app pub date -
Mar 8, 2005
filing date -
Feb 15, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed herein is a stacked package. The stacked package includes two or more of a first BGA package and a second BGA package and a circuit board having a circuit pattern. The first BGA package is mounted on one face of the circuit board, and the second BGA package is mounted on the other face of the circuit board. A signal connection member is provided for transmitting signals of the first BGA package and the second BGA package to each other. The second BGA package is provided with a signal connection pad. One end of the signal connection member is bonded to the signal connection pad and the other end of the signal connection member is bonded to the circuit pattern of the circuit board. A method of fabricating the stacked package is also disclosed.
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