Wafer Cleaning After Via-Etching
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United States of America Patent
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Issued Date -
Aug 28, 2008
app pub date -
Feb 2, 2005
filing date -
Feb 15, 2005
priority date (Note) -
Abandoned
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Abstract
When a semiconductor wafer bears porous dielectric materials it is still possible to perform post-via-etch cleaning of the wafer using aqueous cleaning fluids if, before and/or simultaneously with application of the aqueous cleaning fluid(s), a water-soluble organosilane or like passivation material is used to form a passivation layer on the porous dielectric material.
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