Polymeric Film Substrate for Use in Radio-Frequency Responsive
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United States of America Patent
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Issued Date -
Sep 4, 2008
app pub date -
Mar 16, 2005
filing date -
Mar 16, 2004
priority date (Note) -
Abandoned
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Abstract
A radio-frequency (RF) responsive tag comprising a heat-sealing substrate comprising a polyester layer, and an antenna comprising a patter of conductive material wherein said conductive material is in direct contact with a heat-sealing surface of the substrate, and wherein the shrinkage of the heat-sealing substrate is less than 5% at 190.degree. C. over 30 minutes; a method of manufacture of said RF-response tag.
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