Micromachined Acoustic Transducers

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United States of America Patent

SERIAL NO

12117724

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Abstract

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The present invention relates to an acoustic transducer that includes one or more capsules, side walls and a backing plate. Each capsule contains a cavity formed by the side walls and a plurality of film stacks. Each film stack has one or more membranes that can be a piezoelectric layer. Two or more of the film stacks that form the first cavity faces each other. A film stack and the backing plate face each other and form the wall of a second cavity. The transducers of this invention have a broadband response, can radiate sounds uni-directionally, and produce high quality sounds at low frequencies and at high intensities. They can be driven by AC signals. They can be fabricated using conventional integrated circuit manufacturing processes and therefore can be mass produced easily and inexpensively.

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Patent Owner(s)

Patent OwnerAddress
GENERAL MEMS CORPORATIONCALIFORNIA USA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Yunlong Fremont, CA 52 578

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