US Patent Application No: 2008/0213,978

Number of patents in Portfolio can not be more than 2000

Debris management for wafer singulation

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Abstract

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The present invention discloses methods and apparatuses for substrate singulation. Embodiments of the present invention comprise cryogenic-assist scribing or cutting mechanism for debris reduction, preferably cryogenic-assist laser scribe or cutting; controlling mechanism for debris flow and redeposition during laser process; and integrated, dry debris removal scribing process with breaking mechanism. An exemplary embodiment comprises an integrated housing for aligning a laser beam with the cryogenic cleaning beam. The integrated housing is preferably made of low thermal conductivity material to provide a high temperature gradient between the low temperature of the cryogenic fluid and the ambient temperature, preventing condensation of the moisture. The entire areas, or the critical areas of the apparatus can also be purged with flowing 'dry' inert gases to further reduce the condensation moisture. Reactive gas can be introduced to react with debris, converting into gaseous form for ease of removal.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
DYNATEXSANTO ROSA, CA0

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Henry, Kathaleen Healdsburg, CA 1 8
Makhamreh, Khalid Los Gatos, CA 12 124
Mangano, Stefano Menlo Park, CA 6 237
Reinhardt, Karen Ann San Jose, CA 2 8
Seemann, Ferdinand Livermore, CA 3 12
Setton, David Acher Oakland, CA 1 8
Tannous, Adel George Santa Clara, CA 21 260

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Battelle Energy Alliance, LLC (1)
* 6,183,348 Methods and apparatuses for cutting, abrading, and drilling 1 1998
 
COOL CLEAN TECHNOLOGIES, LLC (1)
* 2006/0124,156 Carbon dioxide snow apparatus 0 2005
 
RAVE N.P., INC. (2)
* 5,853,962 Photoresist and redeposition removal using carbon dioxide jet spray 34 1996
* 5,806,544 Carbon dioxide jet spray disk cleaning system 17 1997
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Abbott Cardiovascular Systems Inc. (1)
* 2010/0102,046 Laser Machining Medical Devices With Localized Cooling 9 2008
 
INTEL CORPORATION (1)
* 2014/0264,827 METHODS OF FORMING WAFER LEVEL UNDERFILL MATERIALS AND STRUCTURES FORMED THEREBY 0 2013
 
DISCO CORPORATION (1)
* 9,236,264 Wafer processing method 0 2014
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (2)
* 7,977,213 Use of laser energy transparent stop layer to achieve minimal debris generation in laser scribing a multilayer patterned workpiece 0 2010
9,259,802 Method and apparatus for collecting material produced by processing workpieces 0 2012
 
UNIVERSITY OF SOUTH CAROLINA (2)
* 8,709,164 Methods and compositions for dislodging debris particles from a substrate 0 2011
* 2012/0066,841 Methods And Compositions For Dislodging Debris Particles From A Substrate 2 2011
 
INFINEON TECHNOLOGIES AG (3)
8,883,565 Separation of semiconductor devices from a wafer carrier 0 2011
9,099,547 Testing process for semiconductor devices 0 2011
9,397,055 Processing of thick metal pads 0 2014
 
CORNING INCORPORATED (1)
8,171,753 Method for cutting a brittle material 6 2009
* Cited By Examiner