Substrate heating apparatus and semiconductor fabrication method
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United States of America Patent
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Oct 5, 2010
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N/A
app pub date -
Dec 6, 2007
filing date -
Dec 8, 2006
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Abstract
A substrate heating apparatus having a heating unit for heating a substrate placed in a process chamber which can be evacuated includes a suscepter which is installed between the heating unit and a substrate, and on which the substrate is mounted, and a heat receiving member which is installed to oppose the suscepter with the substrate being sandwiched between them, and receives heat from the heating unit via the suscepter. A ventilating portion which allows a space formed between the heat receiving member and substrate to communicate with a space in the process chamber is formed.
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