Resistor Device and Method of Manufacturing the Same

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United States of America Patent

SERIAL NO

12044829

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is to provide a method of trimming during short time without any difficulty of controlling a device for trimming and a trimming device having a simple structure. The method of manufacturing a resister device comprises: trimming a resister element 5 including a resister film 4 in order to adjust a resister value of the resister element 5, the resister film 4 contacting a pair of electrodes 3 for a resister formed on a substrate 2. A region of the substrate located in a position of a side portion 6 and along with the resister film 4 is heated in the trimming, the position being on a surface where the electrodes 3 for a resister and the resister film 4 are formed. The heating is performed by laser beam irradiation. The side portion 6 is irradiated by a laser beam to form a concave portion 7.

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Patent Owner(s)

Patent OwnerAddress
KOA CORPORATION3672 ARAI INA-SHI NAGANO 396-0025

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujimoto, Koji Nagano, JP 126 1056

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